The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 21, 1994
Filed:
Dec. 16, 1991
Applicant:
Inventors:
Victor J Adams, Tempe, AZ (US);
Paul T Bennett, Phoenix, AZ (US);
Henry G Hughes, Scottsdale, AZ (US);
Brooks L Scofield, Jr, Tempe, AZ (US);
Marilyn J Stuckey, Phoenix, AZ (US);
Assignee:
Motorola, Inc., Schaumburg, IL (US);
Attorneys:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L / ;
U.S. Cl.
CPC ...
257417 ; 257419 ; 257693 ;
Abstract
A semiconductor wafer level package used to encapsulate a device fabricated on a semiconductor substrate wafer before dicing of the wafer into individual chips. A cap wafer is bonded to the semiconductor substrate wafer using a pre-patterned frit glass as a bonding agent such that the device is hermetically sealed inside a cavity. A hole in the cap wafer allows electrical connections to be made to the device through electrodes which pass through the frit glass seal.