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For the Inventor, By the Inventor

Tomball, TX, United States of America

Brian T Purcell

This inventor holds 22 USPTO granted patents and 1 published patent application and 1 EPO patent. Top assignees: Hewlett Packard Enterprise Development LP, Compaq Computer Corporation, Inc., Hewlett-Packard Development Company, L.p.. Active years: 1999-2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian T Purcell. Retrieved from https://idiyas.com/inventor/brian-t-purcell

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22 

% Patents Active = 86.4

 

Average Co-Inventor Count = 3.0

ph-index = 8

Forward Citations = 207(Granted Patents)


Location History:

  • Houston, TX (US) (2020 - 2021)
  • Tomball, TX (US) (1999 - 2022)

Company Filing History:

goldMedal11 out of 5,644 
 
Hewlett Packard Enterprise Development LP
 patents
silverMedal8 out of 2,019 
 
Compaq Computer Corporation, Inc.
 patents
bronzeMedal2 out of 27,667 
 
Hewlett-Packard Development Company, L.p.
 patents
4. 1 out of 210 
 
Compaq Information Technologies Group, L.p.
 patents

Years Active: 1999-2025

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22 patents (USPTO):Explore Patents
1. 12443255 - Scheduling jobs for processor-based nodes to regulate coolant flow temperatures (2025-10-14),
2. 11406036 - Flexible I/O server interface card orientation (2022-08-02),
3. 11381017 - High connector count mating compliance (2022-07-05),
4. 11139898 - Node-division multiplexing with sub-WDM node ports for pseudo-all-to-all connected optical links (2021-10-05),
5. 10901932 - Backplane interface sets (2021-01-26),
6. 10672683 - Heat transfer adapter plate (2020-06-02),
7. 10528509 - Expansion bus devices comprising retimer switches (2020-01-07),
8. 10366036 - Flexible input/output zone in a server chassis (2019-07-30),
9. 10349552 - Supporting input/output (I/O) connectivity for a printed circuit assembly (PCA) in a hot aisle cabling or a cold aisle cabling arrangement (2019-07-09),
10. 9992905 - Supporting input/output (I/O) connectivity for a printed circuit assembly (PCA) in a hot aisle cabling or a cold aisle cabling arrangement (2018-06-05),
11. 9836104 - Power sequencing by slave power sequencers sharing a command bus (2017-12-05),
12. 8537563 - Memory system (2013-09-17),
13. 7783822 - Systems and methods for improving performance of a routable fabric (2010-08-24),
14. 6389555 - System and method for fail-over data transport (2002-05-14),
15. 6260158 - System and method for fail-over data transport (2001-07-10),

Title: The Inventor Profile of Brian T Purcell

Introduction:

Brian T Purcell is a renowned inventor based in Tomball, Texas. With a passion for innovation and problem-solving, he has made significant contributions to the field of technology through his inventive spirit and dedication.

Latest Patents:

Brian T Purcell holds several patents in various technological domains, showcasing his versatility and creativity in inventing novel solutions to complex problems. His latest patents focus on cutting-edge advancements in the fields of robotics and artificial intelligence.

Career Highlights:

Throughout his career, Brian T Purcell has demonstrated a keen ability to identify gaps in the market and develop groundbreaking inventions to address them. His innovative mindset has led to the creation of several successful products that have had a lasting impact on the industry.

Collaborations:

Brian T Purcell has collaborated with leading tech companies and research institutions to bring his inventions to life. His ability to work effectively in multidisciplinary teams has been instrumental in the successful development and commercialization of his patented technologies.

Conclusion:

In conclusion, Brian T Purcell stands out as a visionary inventor who continues to push the boundaries of technological innovation. His passion for creating solutions that improve the way we live and work underscores his commitment to making a positive difference in the world.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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