This inventor holds 1 USPTO granted patent. Top assignee: International Business Machines Corporation. Active years: 2012.
Company Filing History:
Years Active: 2012
Title: Brian Richard Sundolf: Innovator in Thermal Expansion Technology
Introduction
Brian Richard Sundolf is a notable inventor based in Beacon, NY (US). He has made significant contributions to the field of materials science, particularly in the development of particles with a negative coefficient of thermal expansion. His innovative work has led to advancements that can impact various industries.
Latest Patents
Sundolf holds a patent for a method of forming a negative coefficient of thermal expansion particle. This method involves flattening a hollow sphere made of a first material and annealing it at a reference temperature above a predetermined maximum use temperature. This process sets a stress minimum for the flattened hollow sphere. Additionally, a coating made of a second material, which has a lower coefficient of thermal expansion than the first material, is formed on the flattened hollow sphere. The resulting negative coefficient of thermal expansion particle is characterized by volumetric contraction when heated. He has 1 patent to his name.
Career Highlights
Brian Richard Sundolf is associated with the International Business Machines Corporation, commonly known as IBM. His work at IBM has allowed him to explore and develop innovative technologies that enhance material properties and applications.
Collaborations
Sundolf has collaborated with notable colleagues, including Gareth Geoffrey Hougham and Xiao Hu Liu. These partnerships have contributed to the advancement of his research and the successful development of his patented technologies.
Conclusion
Brian Richard Sundolf is a distinguished inventor whose work in thermal expansion technology has the potential to influence various applications. His innovative methods and collaborations highlight his commitment to advancing materials science.