The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 21, 2012

Filed:

May. 07, 2009
Applicants:

Gareth Geoffrey Hougham, Ossining, NY (US);

Xiao HU Liu, Croton-on-Hudson, NY (US);

S. Jay Chey, Ossining, NY (US);

Joseph Zinter, Jr., Brewster, NY (US);

Michael J. Rooks, Briarcliff Manor, NY (US);

Brian Richard Sundolf, Beacon, NY (US);

Jon Alfred Casey, Poughkeepsie, NY (US);

Inventors:

Gareth Geoffrey Hougham, Ossining, NY (US);

Xiao Hu Liu, Croton-on-Hudson, NY (US);

S. Jay Chey, Ossining, NY (US);

Joseph Zinter, Jr., Brewster, NY (US);

Michael J. Rooks, Briarcliff Manor, NY (US);

Brian Richard Sundolf, Beacon, NY (US);

Jon Alfred Casey, Poughkeepsie, NY (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
B05D 1/36 (2006.01);
U.S. Cl.
CPC ...
Abstract

A method of forming a negative coefficient of thermal expansion particle includes flattening a hollow sphere made of a first material, annealing the flattened hollow sphere at a reference temperature above a predetermined maximum use temperature to set a stress minimum of the flattened hollow sphere, and forming a coating made of a second material on the flattened hollow sphere at the reference temperature, the second material having a lower coefficient of thermal expansion than that of the first material, the negative coefficient of thermal expansion particle characterized by volumetric contraction when heated.


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