Austin, TX, United States of America

Brian Head

This inventor holds 2 USPTO granted patents. Top assignee: Tokyo Electron Limited. Active years: 2010-2012.


% Patents Active = 50.0

Average Co-Inventor Count = 1.5

ph-index = 2

Forward Citations = 15(Granted Patents)


Company Filing History:


Years Active: 2010-2012

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2 patents (USPTO):Explore Patents

Title: Brian Head: Innovator in Thermal Processing Technologies

Introduction

Brian Head is a notable inventor based in Austin, TX (US). He has made significant contributions to the field of thermal processing technologies, holding a total of 2 patents. His work focuses on enhancing the efficiency and effectiveness of substrate processing in various applications.

Latest Patents

Brian's latest patents include the "Electrostatic Post Exposure Bake Apparatus and Method." This invention features an Electrostatic Bake Plate (EBP) designed for use in a processing chamber, which allows for the development of an EPEB wafer with both exposed and unexposed regions. Another significant patent is the "Heat Treatment Apparatus and Methods for Thermally Processing a Substrate Using a Pressurized Gaseous Environment." This technology involves heating a substrate in a pressurized environment, which enhances the thermal processing of layers on the substrate.

Career Highlights

Brian Head is currently employed at Tokyo Electron Limited, a leading company in the semiconductor manufacturing equipment industry. His role involves developing innovative solutions that improve substrate processing techniques.

Collaborations

Throughout his career, Brian has collaborated with talented individuals such as Benjamen M Rathsack and Steven A Scheer. These collaborations have contributed to the advancement of technologies in the field.

Conclusion

Brian Head's contributions to thermal processing technologies through his patents and collaborations highlight his role as an influential inventor in the industry. His work continues to impact the efficiency of substrate processing methods.

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