Albany, OR, United States of America

Brian E Bolf

This inventor holds 3 USPTO granted patents and 2 published patent applications. Top assignee: Hewlett-Packard Development Company, L.p.. Active years: 2004-2019.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian E Bolf. Retrieved from https://idiyas.com/inventor/brian-e-bolf

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 3 

% Patents Active = 100.0

Average Co-Inventor Count = 5.6

ph-index = 2

Forward Citations = 10(Granted Patents)


Location History:

  • Albany, OR (US) (2004 - 2006)
  • Corvallis, OR (US) (2019)

Company Filing History:


Years Active: 2004-2019

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3 patents (USPTO):Explore Patents

Title: Brian E Bolf: Innovator in Energy Efficiency

Introduction

Brian E Bolf is a notable inventor based in Albany, OR (US). He has made significant contributions to the field of energy-efficient technologies, particularly in printhead design. With a total of 3 patents to his name, Bolf continues to push the boundaries of innovation.

Latest Patents

One of Bolf's latest patents is for energy-efficient printheads. This invention discloses a printhead that includes a substrate with channels designed to direct ink toward a plurality of nozzles. Additionally, the printhead features a passivation layer on the substrate, which consists of a first thin film of a dielectric material formed using atomic layer deposition. Another significant patent is for a method of making a tunneling emitter. This emitter comprises an electron supply layer and a tunneling layer formed on it. An insulator layer may also be included, with openings defined within it for the tunneling layer. A cathode layer is formed on the tunneling layer to facilitate energy emissions of electrons and/or photons. The emitter is preferably subjected to an annealing process to enhance the supply of electrons tunneled from the electron supply layer to the cathode layer.

Career Highlights

Brian E Bolf is currently employed at Hewlett-Packard Development Company, L.P. His work focuses on developing innovative technologies that enhance energy efficiency in printing solutions. Bolf's expertise in this area has positioned him as a key player in the advancement of print technology.

Collaborations

Bolf has collaborated with several talented individuals in his field, including Zhizhang Chen and Michael John Regan. These collaborations have contributed to the successful development of his innovative patents.

Conclusion

Brian E Bolf is a distinguished inventor whose work in energy-efficient technologies has made a significant impact in the printing industry. His patents reflect a commitment to innovation and sustainability.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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