Taipei, Taiwan

Brian Chang

This inventor holds 1 USPTO granted patent. Top assignee: Shuttle Inc.. Active years: 2009.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Brian Chang. Retrieved from https://idiyas.com/inventor/brian-chang-obzopa35

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


Average Co-Inventor Count = 3.0

ph-index = 1

Forward Citations = 9(Granted Patents)


Company Filing History:


Years Active: 2009

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1 patent (USPTO):Explore Patents

Title: Brian Chang - Innovator in Heat Dissipation Technology

Introduction

Brian Chang is a notable inventor based in Taipei, Taiwan. He has made significant contributions to the field of electronic devices, particularly in the area of heat dissipation. His innovative approach addresses the challenges associated with managing heat in electronic systems.

Latest Patents

Brian Chang holds a patent for a "Heat dissipation structure for electronic devices." This invention discloses a heat-dissipation structure that includes a housing with an accommodation space for at least one heat-generating element. It features a heat conductor that contacts the heat-generating element and an electric fan positioned outside the housing. The design allows for improved heat-dissipation efficiency by promoting airflow through the heat conductor.

Career Highlights

Brian Chang is currently employed at Shuttle Inc., where he continues to develop innovative solutions for electronic devices. His work has garnered attention for its practical applications in enhancing device performance and longevity.

Collaborations

Brian has collaborated with talented coworkers, including Chien-Hsiang Liu and Fun-Son Yeh, who contribute to the innovative environment at Shuttle Inc.

Conclusion

Brian Chang's contributions to heat dissipation technology exemplify the importance of innovation in the electronics industry. His patent reflects a commitment to improving device efficiency and performance.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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