The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 7554805 B1

PDF
Full Text
Expired
Date of Patent:
Jun. 30, 2009

Filed:

Jun. 25, 2007
Applicants:

Chien-hsiang Liu, Taipei, TW;

Fun-son Yeh, Taipei, TW;

Brian Chang, Taipei, TW;

Inventors:

Chien-Hsiang Liu, Taipei, TW;

Fun-Son Yeh, Taipei, TW;

Brian Chang, Taipei, TW;

Assignee:

Shuttle Inc., Taipei, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 7/20 (2006.01);
U.S. Cl.
CPC ...
Abstract

The present invention discloses a heat-dissipation structure for electronic devices, which comprises: a housing having an accommodation space accommodating at least one heat-generating element; a heat conductor arranged in the accommodation space and contacting the heat-generating element; and an electric fan arranged outside the housing. The housing has an opening corresponding to the heat conductor, and the heat conductor extends through the opening and projects from the housing. The electric fan drives an air current to flow through the part of the heat conductor extending through the opening to promote heat-dissipation efficiency.


Find Patent Forward Citations

Liu, Chien-Hsiang. (2009). Heat dissipation structure for electronic devices (U.S. Patent No. 7554805). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/7554805

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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