Bradley M Schultz

Title: The Innovative Contributions of Bradley M Schultz

Introduction

Bradley M Schultz is a notable inventor based in Mechanicsburg, PA (US). He has made significant contributions to the field of plating technology, particularly in improving contact resistance in corrosive environments. His innovative approach has led to the development of a unique layered plating stack that addresses critical challenges in the industry.

Latest Patents

One of Schultz's key patents is titled "Layered plating stack for improved contact resistance in corrosive environments." This invention features a layered plating stack that includes an underlying plating layer formed on a substrate, an intermediate plating layer, an outer plating layer, and at least one strike layer of noble metal. The noble metal in the strike layer differs from the metal in the intermediate plating layer. This innovative design maintains a contact resistance of below 25 mohms when tested under specific conditions, showcasing its effectiveness in harsh environments.

Career Highlights

Bradley M Schultz is currently associated with Te Connectivity Solutions GmbH, where he continues to apply his expertise in plating technologies. His work has been instrumental in advancing the company's capabilities in developing reliable and efficient solutions for various applications.

Collaborations

Throughout his career, Schultz has collaborated with talented professionals, including Suvrat Bhargava and Matthew Little. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Bradley M Schultz's contributions to the field of plating technology exemplify the impact of innovative thinking in addressing industry challenges. His patented work not only enhances product performance but also sets a benchmark for future developments in the field.