Te Connectivity Solutions Gmbh

Bradley M Schultz

Martin William Bayes

Suvrat Bhargava

Matthew Little

Rodney Ivan Martens

A layered plating stack which includes an underlying plating layer formed on a substrate; an intermediate plating layer; an outer plating layer; and at least one strike layer of noble metal. The noble metal of the strike layer is a different metal than the metal of the intermediate plating layer. The layered plating stack with the strike layer maintains contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams after 1 or more days of exposure to a gaseous environment which includes Cl, NOand SO. The layered plating stack with the strike layer also maintains a contact resistance of below 25 mohms when tested under a load of at least approximately 30 grams with a wipe of at least approximately 0.1 mm after exposure to a gaseous environment which includes one or more of HS, Cl, NOand SO.

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Mechanicsburg, PA, United States of America

Bradley M Schultz