Columbus, OH, United States of America

Boyuan Li

This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: The Ohio State University. Active years: 2025.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Boyuan Li. Retrieved from https://idiyas.com/inventor/boyuan-li-qmjkmfqs

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2025

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1 patent (USPTO):Explore Patents

Title: Boyuan Li: Inventor in Columbus, Ohio.

Introduction

Boyuan Li is an inventor based in Columbus, Ohio, and is associated with The Ohio State University. His patent work addresses fault detection and sensor deployment in monitored systems.

Latest Patents

The provided information lists one patent for Li: “Propagation-Based Fault Detection and Discrimination Method and the Optimization of Sensor Deployment.” The method models a system and identifies its steady and transient operating states. It then simulates those states with injected faults and analyzes the results to develop strategies for detecting and distinguishing faults. The strategies can also help select an effective set of sensors.

Career Highlights

Li’s listed patent count is 1 patent. His work connects system modeling and simulation with practical approaches to fault detection and sensor selection.

Collaborations

The provided information names Carol Smidts and Xiaoxu Diao as Li’s coworkers. His institutional affiliation is The Ohio State University.

Conclusion

Boyuan Li’s patent focuses on using operating-state simulations to improve fault detection and guide sensor deployment.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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