Company Filing History:
2 out of 1,626 
1 out of 22 Years Active: 1994-1999
Title: Boydd Piper: Innovator in Electrical Circuit Packaging
Introduction
Boydd Piper is a notable inventor based in Eau Claire, WI (US). He has made significant contributions to the field of electrical circuit packaging, holding a total of 3 patents. His innovative methods have advanced the way substrates and stiffeners are aligned and laminated in electronic devices.
Latest Patents
One of Boydd Piper's latest patents is a method for aligning and laminating substrates to stiffeners. This method involves placing a substrate within an alignment frame, applying adhesive, and then positioning a stiffener on the adhesive to create a chip package. The process includes applying heat and pressure to cure the adhesive, enhancing the rigidity of the package. Another significant patent focuses on coining solder balls on an electrical circuit package. This method entails placing a slug on the solder balls and applying pressure to flatten them into planar solder coins, improving the overall functionality of the package.
Career Highlights
Throughout his career, Boydd Piper has worked with reputable companies such as W. L. Gore & Associates, Inc. and Supercomputer Systems Limited Partnership. His experience in these organizations has contributed to his expertise in electrical circuit technology and innovation.
Collaborations
Boydd has collaborated with notable individuals in his field, including William George Petefish and David B Noddin. These partnerships have likely fostered a creative environment that has led to further advancements in his work.
Conclusion
Boydd Piper's contributions to electrical circuit packaging through his innovative patents and career experiences highlight his role as a significant inventor in the industry. His methods continue to influence the development of more efficient electronic devices.