The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 16, 1999
Filed:
Nov. 08, 1996
William George Petefish, Eau Claire, WI (US);
Boydd Piper, Eau Claire, WI (US);
W. L. Gore & Associates, Inc., Newark, DE (US);
Abstract
A method and apparatus are provided for aligning and laminating stiffeners to substrates in electrical circuits. Generally, this method includes placing a substrate within an alignment frame or tool; applying an adhesive on the substrate; placing a stiffener on the adhesive to form a chip package; applying sufficient pressure and heat to the package for a sufficient time to cure the adhesive. Another method of the present invention includes placing a substrate within an alignment tool or frame; applying an adhesive on the substrate within the alignment tool; placing a stiffener on the adhesive to form a package; applying sufficient heat and pressure to the package for a sufficient time to tack the stiffener to the substrate; removing the package from the alignment tool or frame; and heating the package for a sufficient time and temperature to cure the adhesive wherein the stiffener enhances rigidity of the package.