Boon Pek Liew

Title: Boon Pek Liew: Innovator in Semiconductor Technology

Introduction

Boon Pek Liew is a notable inventor based in Singapore, recognized for his contributions to semiconductor technology. His innovative work has led to the development of a unique image sensor with a processor package, showcasing his expertise in the field.

Latest Patents

Boon Pek Liew holds a patent for an image sensor with a processor package. This patent describes a semiconductor package that includes a multi-layer package substrate with embedded interconnect structures. The design features a sensor chip with an image sensing element positioned on the top surface of the package substrate, while an integrated circuit is mounted on the bottom surface. The integrated circuit utilizes a flip-chip assembly, ensuring that the sensor chip is electrically connected to it. Additionally, an adhesive material secures a transparent covering member to the sensor chip, effectively enclosing the image sensing element. This innovative approach enhances the functionality and efficiency of image sensors.

Career Highlights

Boon Pek Liew is currently employed at Utac Headquarters Pte. Ltd., where he continues to advance his work in semiconductor technology. His role at the company allows him to collaborate with other talented professionals in the industry.

Collaborations

Some of his coworkers include Tim Thian Hwee Tan and Chee Kay Chow, who contribute to the innovative environment at Utac Headquarters Pte. Ltd. Their collaboration fosters a culture of creativity and technological advancement.

Conclusion

Boon Pek Liew's contributions to the field of semiconductor technology, particularly through his patent for an image sensor with a processor package, highlight his role as an influential inventor. His work continues to impact the industry positively, showcasing the importance of innovation in technology.