Utac Headquarters Pte. Ltd.

Boon Pek Liew

Chee Kay Chow

Teddy Joaquin Carreon

Tim Thian Hwee Tan

A semiconductor package and a method for forming a semiconductor package are disclosed. The semiconductor package includes a multi-layer package substrate having interconnect structures embedded therein. A sensor chip having an image sensing element is disposed on a top surface of the package substrate, and an integrated circuit is mounted to a bottom surface of the package substrate. The integrated circuit is a flip-chip assembly. The sensor chip is electrically connected to the integrated circuit. An adhesive material bonds a transparent covering member to the sensor chip to enclose the image sensing element.

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Singapore, Singapore

Boon Pek Liew