Location History:
- Singapore, MY (2010)
- Singapore, SG (2008 - 2013)
Company Filing History:
5 out of 1,477 
1 out of 629 
Years Active: 2008-2013
Title: Boon Keng Lok: Innovator in Interconnect Structures and Circuit Board Technology
Introduction
Boon Keng Lok is a notable inventor based in Singapore, recognized for his contributions to interconnect structures and circuit board technology. With a total of five patents to his name, he has made significant advancements in the field of electronics.
Latest Patents
Boon Keng Lok's latest patents include an innovative interconnect structure and a method of fabricating the same. This interconnect structure is designed for interconnecting first and second components, as well as for connecting multiple component stacks to a substrate. The structure features a base portion formed on a mounting surface of a first component, a pillar portion extending perpendicularly from the base, and a head portion with larger lateral dimensions than the pillar. Additionally, he has developed a method for forming a circuit board, which involves mounting passive components on a laminate material, interconnecting them to contact traces and vias, and attaching a second laminate material through a lamination process.
Career Highlights
Boon Keng Lok has worked with prominent organizations such as the Agency for Science, Technology and Research and Nanyang Technological University. His experience in these institutions has allowed him to refine his skills and contribute to groundbreaking research in his field.
Collaborations
Boon Keng Lok has collaborated with notable colleagues, including Chee Wai Lu and Chee Khuen Stephen Wong. Their teamwork has fostered innovation and development in various projects.
Conclusion
Boon Keng Lok's work in interconnect structures and circuit board technology showcases his innovative spirit and dedication to advancing electronic engineering. His contributions continue to impact the industry positively.