The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jun. 11, 2013
Filed:
Oct. 21, 2008
Chee Khuen Stephen Wong, Singapore, SG;
Hock Lye John Pang, Singapore, SG;
Wei Fan, Singapore, SG;
Haijing LU, Singapore, SG;
Boon Keng Lok, Singapore, SG;
Chee Khuen Stephen Wong, Singapore, SG;
Hock Lye John Pang, Singapore, SG;
Wei Fan, Singapore, SG;
Haijing Lu, Singapore, SG;
Boon Keng Lok, Singapore, SG;
Agency for Science Technology and Research, Singapore, SG;
Nanyang Technological University, Singapore, SG;
Abstract
An interconnect structure, an interconnect structure for interconnecting first and second components, an interconnect structure for interconnecting a multiple component stack and a substrate, and a method of fabricating an interconnect structure. The interconnect structure comprising a base portion formed on a mounting surface of a first component; a pillar portion extending from the base portion and substantially perpendicularly to the mounting surface; and a head portion formed on the pillar portion and having larger lateral dimensions than the pillar portion; wherein the base portion and the pillar portion are integrally formed of a homogeneous material.