The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Apr. 27, 2010
Filed:
Oct. 18, 2005
Applicants:
Chee Wai Albert LU, Singapore, MY;
Boon Keng Lok, Singapore, MY;
Chee Khuen Stephen Wong, Singapore, SG;
Kai Meng Chua, Singapore, SG;
Lai Lai Wai, Singapore, SG;
Sunnappan Vasudivan, Singapore, SG;
Inventors:
Chee Wai Albert Lu, Singapore, MY;
Boon Keng Lok, Singapore, MY;
Chee Khuen Stephen Wong, Singapore, SG;
Kai Meng Chua, Singapore, SG;
Lai Lai Wai, Singapore, SG;
Sunnappan Vasudivan, Singapore, SG;
Assignee:
Agency for Science, Technology & Research, Centros, SG;
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H01L 23/48 (2006.01); H05L 1/11 (2006.01); H04B 3/28 (2006.01);
U.S. Cl.
CPC ...
Abstract
A substrate for power decoupling and a method of forming a substrate for power decoupling. The substrate comprises one or more decoupling capacitors; and one or more interconnections to the decoupling capacitors. At least one of the interconnections comprises a lossy material.