Dongguan, China

Boning Huang

USPTO Granted Patents = 11 

 

Average Co-Inventor Count = 3.1

ph-index = 4

Forward Citations = 20(Granted Patents)


Location History:

  • Shenzhen, CN (2013 - 2019)
  • Dongguan, CN (2021 - 2023)

Company Filing History:


Years Active: 2013-2025

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11 patents (USPTO):

Title: Innovations of Inventor Boning Huang

Introduction

Boning Huang, an accomplished inventor based in Dongguan, China, has made significant contributions to the field of semiconductor technologies. With 11 patents to his name, he is recognized for his innovative approaches to enhancing the performance and accuracy of electronic devices.

Latest Patents

Among Boning Huang's most recent inventions are advanced semiconductor technologies. His patent for a **composite substrate** involves a preparation method that incorporates a first silicon carbide layer made of monocrystalline silicon carbide, bonded to a second silicon carbide layer. This design aims to improve the defect density between the two layers, enhancing overall efficiency in semiconductor applications. Another notable patent is the **IGBT chip integrating a temperature sensor**, which seeks to elevate accuracy in temperature monitoring of the IGBT chip. This invention includes various essential components such as a cell region, emitter pad, gate pad, temperature sensing module, and a conductive shielding structure, demonstrating Huang’s technical expertise in power devices.

Career Highlights

Boning Huang has garnered valuable industry experience by working with leading companies such as Huawei Technologies Co., Limited and Huawei Digital Power Technologies Co., Ltd. His roles at these firms have allowed him to apply his innovative designs and contribute to breakthroughs in semiconductor technology.

Collaborations

Throughout his career, Boning Huang has collaborated with talented professionals, including **Wenbin Chen** and **Shengyong Dai**. Working together, they have advanced research and development efforts within the semiconductor field, enhancing the capabilities of their projects.

Conclusion

Boning Huang stands out as a pioneering inventor whose developments in semiconductor technologies demonstrate his commitment to innovation. With his multitude of patents, he continues to influence the future of electronic devices and the semiconductor industry. As he progresses in his career, his inventions are sure to leave a lasting impact on technology and engineering.

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