The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Jul. 22, 2025

Filed:

Jul. 05, 2022
Applicant:

Huawei Technologies Co., Ltd., Guangdong, CN;

Inventors:

Bo Gao, Dongguan, CN;

Boning Huang, Dongguan, CN;

Yuxi Wan, Dongguan, CN;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H10D 62/832 (2025.01); H01L 21/02 (2006.01);
U.S. Cl.
CPC ...
H10D 62/8325 (2025.01); H01L 21/02447 (2013.01); H01L 21/02529 (2013.01); H01L 21/02598 (2013.01); H01L 21/02694 (2013.01);
Abstract

Embodiments of this application relate to the field of semiconductor technologies, and provide composite substrate that comprises: a first silicon carbide layer comprising monocrystalline silicon carbide, and a second silicon carbide layer bonded to the first silicon carbide layer, wherein defect density of at least a part of the second silicon carbide layer is greater than defect density of the first silicon carbide layer.


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