Hwaseong-si, South Korea

Bongju Cho

This inventor holds 1 USPTO granted patent and 2 published patent applications. Top assignee: Samsung Electronics Ltd.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bongju Cho. Retrieved from https://idiyas.com/inventor/bongju-cho-btgvpja5

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 1 

Average Co-Inventor Count = 1.0


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Bongju Cho - Innovator in Semiconductor Technology

Introduction

Bongju Cho is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package that enhances heat dissipation.

Latest Patents

Bongju Cho holds a patent for a semiconductor package that includes a heat dissipation structure. This semiconductor package features a first rewiring layer, a lower semiconductor chip, an upper semiconductor chip, and a heat dissipation structure. The design also incorporates a molding layer and a second rewiring layer, ensuring efficient thermal management and connectivity between the components. This invention is crucial for improving the performance and reliability of semiconductor devices.

Career Highlights

Bongju Cho is currently employed at Samsung Electronics Ltd., a leading global technology company. His role at Samsung has allowed him to work on cutting-edge projects in semiconductor design and manufacturing. His expertise in this area has positioned him as a valuable asset to the company.

Collaborations

Bongju Cho has collaborated with notable colleagues, including Myungsam Kang and Jeongseok Kim. These partnerships have fostered a creative environment that encourages innovation and the development of advanced technologies.

Conclusion

Bongju Cho's contributions to semiconductor technology exemplify the importance of innovation in the tech industry. His patent for a semiconductor package with a heat dissipation structure showcases his commitment to enhancing device performance. Through his work at Samsung Electronics Ltd., he continues to push the boundaries of what is possible in semiconductor design.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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