This inventor holds 4 USPTO granted patents and 11 published patent applications and 2 EPO patents. Top assignee: Qualcomm Incorporated. Active years: 2020-2026.
Company Filing History:
Years Active: 2020-2026
Title: Bohan Yan: Innovator in Integrated Circuit Technology
Introduction
Bohan Yan is a prominent inventor based in San Diego, CA, known for his contributions to integrated circuit (IC) technology. With a total of 4 patents to his name, Yan has made significant advancements in the field of electronics, particularly in thermal management solutions for IC packages.
Latest Patents
Yan's latest patents include innovative designs that enhance the thermal performance of integrated circuits. One notable patent describes an IC package that employs a metal block with metal interconnects to thermally couple a semiconductor die to an interposer substrate. This design effectively dissipates thermal energy from the die, allowing for improved performance and reliability in electronic devices. Another patent focuses on thermal structures adapted to electronic device heights in IC packages. This invention includes a heat-generating device and an electrical device on a substrate, with a thermal structure that enhances heat dissipation without the use of mold compounds.
Career Highlights
Bohan Yan is currently employed at Qualcomm Incorporated, a leading company in the telecommunications and semiconductor industry. His work at Qualcomm has allowed him to push the boundaries of IC technology, contributing to the development of advanced electronic devices.
Collaborations
Yan has collaborated with notable colleagues such as Kuiwon Kang and Aniket Patil, further enriching his work and expanding the impact of his innovations in the field.
Conclusion
Bohan Yan's contributions to integrated circuit technology demonstrate his commitment to innovation and excellence. His patents reflect a deep understanding of thermal management in electronics, positioning him as a key figure in the advancement of modern technology.