This inventor holds 4 USPTO granted patents. Top assignee: Cisco Technology, Inc.. Active years: 2010-2015.
Company Filing History:
Years Active: 2010-2015
Title: Bob Needham: Innovator in High Density Interconnect Technology
Introduction
Bob Needham is a prominent inventor based in San Jose, CA (US), known for his contributions to the field of application specific integrated circuits (ASICs) and printed circuit board (PCB) design. With a total of 4 patents to his name, Needham has made significant strides in optimizing the performance and efficiency of electronic components.
Latest Patents
Among his latest patents, Needham has developed techniques for optimizing ASIC pinouts for high density interconnect (HDI) printed circuit boards. These techniques aim to systematically and strategically plan pin assignments, which can lead to a reduction in PCB layer count and associated costs. Additionally, his innovations enhance signal integrity and speed, minimize the surface area used by ASICs and their support circuitry, and reduce issues such as plane perforations and via crosstalk when compared to conventional designs.
Career Highlights
Bob Needham is currently employed at Cisco Technology, Inc., where he continues to push the boundaries of technology in the field of integrated circuits and PCB design. His work has been instrumental in advancing the capabilities of electronic devices, making them more efficient and reliable.
Collaborations
Throughout his career, Needham has collaborated with notable colleagues, including Linda M Mazaheri and Steven C Bird. These partnerships have contributed to the development of innovative solutions in the technology sector.
Conclusion
Bob Needham's contributions to the field of ASIC and PCB design have established him as a key figure in the innovation landscape. His patents reflect a commitment to enhancing electronic performance and efficiency, making a lasting impact on the industry.