Bob Bigwood

Title: Bob Bigwood - Innovator in Semiconductor Technology

Introduction

Bob Bigwood is a notable inventor based in Hillsboro, Oregon. He has made significant contributions to the field of semiconductor technology, particularly through his innovative patent related to winged vias. His work has implications for improving overlay margins in semiconductor manufacturing processes.

Latest Patents

Bob Bigwood holds a patent titled "Winged vias to increase overlay margin." This patent describes winged via structures designed to enhance overlay margins. The method involves depositing a sacrificial layer onto an interlayer dielectric, which is coupled with a semiconductor substrate. It includes forming trench structures in the sacrificial layer, depositing a light-sensitive material, and patterning winged via structures that extend beyond the trench width onto the sacrificial layer.

Career Highlights

Bob Bigwood is currently employed at Intel Corporation, a leading company in semiconductor manufacturing. His work at Intel has allowed him to focus on advancing technologies that are critical to the industry. With a patent portfolio that includes 1 patent, he has established himself as a valuable contributor to the field.

Collaborations

Throughout his career, Bob has collaborated with talented individuals such as Martin Weiss and Shannon Daviess. These collaborations have fostered an environment of innovation and have led to advancements in semiconductor technology.

Conclusion

Bob Bigwood's contributions to semiconductor technology through his patent on winged vias demonstrate his commitment to innovation in the field. His work at Intel Corporation and collaborations with other professionals highlight the importance of teamwork in driving technological advancements.