Company Filing History:
Years Active: 2025
Title: Bo Yang: Innovator in Semiconductor Technology
Introduction
Bo Yang is a notable inventor based in Dublin, California, who has made significant contributions to the field of semiconductor technology. With a total of two patents to his name, Yang's work focuses on enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Yang's latest patents include a "Die separation ring for wafers having a large die aspect ratio." This innovative die separation ring is designed to cause non-uniform expansion of a semiconductor wafer during the expansion process. The ring features an annular body that extends around a central axis, with a first portion at a higher elevation and a second portion at a lower elevation. A third portion connects these two, creating a smooth transition. Another significant patent is for a "Semiconductor storage device including staggered semiconductor memory devices on opposed surfaces." This design involves a pliable printed circuit board (PCB) that accommodates semiconductor memory devices mounted on both major surfaces. The staggered arrangement allows the PCB to flex, accommodating any warping of the memory devices.
Career Highlights
Bo Yang is currently employed at Sandisk Technologies Inc., where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in developing advanced storage solutions that meet the demands of modern technology.
Collaborations
Yang collaborates with talented colleagues, including Fu Xing Chan and Chun Sean Lau, who contribute to the innovative environment at Sandisk Technologies Inc.
Conclusion
Bo Yang's contributions to semiconductor technology through his patents and work at Sandisk Technologies Inc. highlight his role as a key innovator in the industry. His advancements are paving the way for more efficient and flexible semiconductor devices.