Sandisk Technologies Inc.

Bo Yang

Xiaodong Liu

Chun Sean Lau

Weiting Jiang

Xiangyang Liu

Xuri Xin

Shuo Li

Zhenghao Wu

Fu Xing Chan

A die separation ring that causes non-uniform expansion of a semiconductor wafer during a semiconductor wafer expansion process. The die separation ring includes an annular body that extends about a central axis. The annular body of the die separation ring includes a first portion having a first elevation and a second portion having a second elevation that is lower than the first elevation. A third portion extends between the first portion and the second portion forming a transition between the first portion and the second portion.

Die separation ring for wafers having a large die aspect ratio

A semiconductor storage device such as an SSD includes a pliable printed circuit board (PCB) having semiconductor memory devices mounted by solder balls on first and second opposed major surfaces. The memory devices are mounted so as to be staggered and/or partially overlapping with each other on the first and second surfaces of the PCB in at least one direction. The staggered arrangement allows the PCB to flex upon warping of the memory devices mounted on the PCB.

Semiconductor storage device including staggered semiconductor memory devices on opposed surfaces

Growing community of inventors

Dublin, CA, United States of America

Bo Yang