The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Jul. 01, 2025
Filed:
May. 23, 2022
Sandisk Technologies, Inc., Milpitas, CA (US);
Shuo Li, Shanghai, CN;
Xiangyang Liu, Shanghai, CN;
Xiaodong Liu, Shanghai, CN;
Xuri Xin, Shanghai, CN;
Weiting Jiang, Shanghai, CN;
Zhenghao Wu, Shenzhen, CN;
Bo Yang, Dublin, CA (US);
Sandisk Technologies, Inc., Milpitas, CA (US);
Abstract
A die separation ring that causes non-uniform expansion of a semiconductor wafer during a semiconductor wafer expansion process. The die separation ring includes an annular body that extends about a central axis. The annular body of the die separation ring includes a first portion having a first elevation and a second portion having a second elevation that is lower than the first elevation. A third portion extends between the first portion and the second portion forming a transition between the first portion and the second portion.