Zhenghao Wu

Title: The Innovations of Zhenghao Wu

Introduction

Zhenghao Wu is a prominent inventor based in Shenzhen, China. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique patent that addresses challenges in the semiconductor wafer expansion process.

Latest Patents

Zhenghao Wu holds a patent titled "Die separation ring for wafers having a large die aspect ratio." This invention introduces a die separation ring that causes non-uniform expansion of a semiconductor wafer during the expansion process. The design features an annular body that extends about a central axis, with a first portion having a higher elevation and a second portion that is lower. A third portion connects these two, creating a smooth transition between the differing elevations.

Career Highlights

Zhenghao Wu is currently employed at Sandisk Technologies Inc., where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in enhancing the efficiency and effectiveness of semiconductor manufacturing processes.

Collaborations

Zhenghao has collaborated with notable colleagues, including Shuo Li and Xiangyang Liu. Their combined expertise has contributed to the advancement of technology in their field.

Conclusion

Zhenghao Wu's contributions to semiconductor technology through his innovative patent demonstrate his commitment to advancing the industry. His work continues to influence the development of more efficient manufacturing processes in the semiconductor sector.