Bo Yang

Title: Bo Yang: Innovator in Semiconductor Technology

Introduction

Bo Yang is a prominent inventor based in Milpitas, CA (US), known for his significant contributions to semiconductor technology. With a total of 8 patents to his name, he has made remarkable advancements in the field, particularly in the design and manufacturing of semiconductor devices.

Latest Patents

Among his latest patents is a groundbreaking invention titled "Semiconductor device including a suspended reinforcing layer and method of manufacturing same." This patent describes a semiconductor device that features a substrate, semiconductor dies, molding compound, and a reinforcing layer suspended within the molding compound. The reinforcing layer, which can be a copper foil, is formed during the compression molding process and provides additional strength and thermal conductivity to the device. Another notable patent is for a "Protective enclosure for an electronic device," which focuses on a protective enclosure for a PCB assembly, such as a solid-state-drive assembly. This innovative design includes a flexible, stamped-metal heat spreader that connects to the packaged integrated circuits, significantly reducing the risk of solder-joint failure under thermal cycling.

Career Highlights

Bo Yang is currently employed at Western Digital Technologies, Inc., where he continues to push the boundaries of semiconductor innovation. His work has been instrumental in enhancing the performance and reliability of electronic devices.

Collaborations

Throughout his career, Bo has collaborated with talented individuals such as Ning Ye and Yangming Liu, contributing to a dynamic and innovative work environment.

Conclusion

Bo Yang's contributions to semiconductor technology exemplify the spirit of innovation and dedication to advancing electronic device performance. His patents reflect a deep understanding of the complexities involved in semiconductor design and manufacturing.