This inventor holds 1 USPTO granted patent and 3 published patent applications. Top assignee: Luxnet Corporation. Active years: 2017.
Company Filing History:
Years Active: 2017
Title: Bo-Wei Liu: Innovator in Flexible Printed Circuit Technology
Introduction
Bo-Wei Liu is a notable inventor based in Zhongli, Taiwan. He has made significant contributions to the field of flexible printed circuits, showcasing his expertise through innovative designs and practical applications. His work is particularly focused on enhancing the integrity of high-frequency signals in electronic devices.
Latest Patents
One of Bo-Wei Liu's key patents is for a flexible printed circuit and printed circuit board soldered structure. This invention includes signal transmission lines that eliminate the need for through holes, thereby improving the integrity of high-frequency signals. The unique design of the signal line structure allows for a reliable high-frequency signal transmission interface. Additionally, it enables a soldering technique that is both practical and compatible with flexible printed circuits and printed circuit boards.
Career Highlights
Bo-Wei Liu is associated with Luxnet Corporation, where he applies his innovative ideas to develop advanced electronic solutions. His work has garnered attention for its potential to revolutionize the way flexible printed circuits are utilized in various applications.
Collaborations
Throughout his career, Bo-Wei Liu has collaborated with talented individuals such as Ho-I Chen and Yi-Ching Chiu. These partnerships have contributed to the successful development of his inventions and have fostered a collaborative environment for innovation.
Conclusion
Bo-Wei Liu's contributions to flexible printed circuit technology highlight his role as a leading inventor in the field. His innovative designs and practical applications continue to influence the electronics industry, paving the way for future advancements.