The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Dec. 26, 2017

Filed:

Mar. 16, 2017
Applicant:

Luxnet Corporation, Zhongli, Taoyuan County, TW;

Inventors:

Ho-I Chen, Zhongli, TW;

Yi-Ching Chiu, Zhongli, TW;

Bo-Wei Liu, Zhongli, TW;

Hsing-Yen Lin, Zhongli, TW;

Hua-Hsin Su, Zhongli, TW;

Assignee:

Luxnet Corporation, Zhongli, Taoyuan County, TW;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/00 (2006.01); H05K 1/14 (2006.01); H01R 12/61 (2011.01); H01R 4/02 (2006.01); H05K 1/02 (2006.01); H05K 1/11 (2006.01);
U.S. Cl.
CPC ...
H05K 1/141 (2013.01); H01R 4/02 (2013.01); H01R 12/61 (2013.01); H05K 1/0245 (2013.01); H05K 1/112 (2013.01); H05K 2201/041 (2013.01); H05K 2201/058 (2013.01);
Abstract

A flexible printed circuit and printed circuit board soldered structure is provided. The structure includes signal transmission lines which dispense with any through hole, thereby enhancing integrity of high-frequency signals. The special design of the signal line structure of the flexible printed circuit and the printed circuit board together provides a satisfactory high-frequency signal transmission interface and enables a soldering technique which is highly practicable and compatible with the flexible printed circuit and printed circuit board soldered structure.


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