This inventor holds 1 USPTO granted patent and 1 published patent application. Top assignee: Taiwan Semiconductor Manufacturing Comp. Ltd.. Active years: 2026.
Company Filing History:
Years Active: 2026
Title: Bo-Tao Chen: Innovator in Semiconductor Packaging
Introduction
Bo-Tao Chen is a prominent inventor based in Taipei, Taiwan. He has made significant contributions to the field of semiconductor packaging, showcasing his expertise through innovative designs and methods. His work is particularly focused on enhancing the efficiency and functionality of semiconductor devices.
Latest Patents
Bo-Tao Chen holds a patent for a semiconductor package and method of manufacturing the same. The patent describes a package structure that includes a semiconductor die laterally encapsulated by an encapsulant, a redistribution structure, and bumps. The redistribution structure is positioned on the semiconductor die and the encapsulant, establishing electrical connections with the semiconductor die. The bumps are located on the redistribution structure, which consists of dielectric layers and metallic pattern layers. Notably, the outermost dielectric layer features undercut cavities beside the metallic pads, enhancing the overall design.
Career Highlights
Bo-Tao Chen is associated with Taiwan Semiconductor Manufacturing Company Limited, a leading entity in the semiconductor industry. His role at the company has allowed him to work on cutting-edge technologies and contribute to advancements in semiconductor packaging.
Collaborations
One of his notable coworkers is Kuan-Chung Lu, with whom he has likely collaborated on various projects within the semiconductor field.
Conclusion
Bo-Tao Chen's innovative work in semiconductor packaging exemplifies his commitment to advancing technology in this critical area. His contributions continue to influence the industry and pave the way for future developments.