Bo-Syun Chen

Title: Bo-Syun Chen: Innovator in Semiconductor Packaging

Introduction

Bo-Syun Chen is a prominent inventor based in Kaohsiung, Taiwan. He has made significant contributions to the field of semiconductor packaging, holding a total of 2 patents. His work focuses on innovative structures and methods that enhance the efficiency and performance of semiconductor devices.

Latest Patents

Chen's latest patents include a semiconductor package structure and method for manufacturing the same. This invention features a semiconductor package structure that consists of a first substrate, at least one first semiconductor element attached to the first substrate, and a second substrate. The second substrate is designed with a plurality of thermal vias and conductive vias, ensuring that one end of each thermal via directly contacts the first semiconductor element. Another patent also describes a semiconductor package structure that includes a first substrate, a first semiconductor element, and a second substrate defining a cavity. This design allows for effective thermal management, as the first semiconductor element is thermally connected to the thermal vias exposed within the cavity.

Career Highlights

Bo-Syun Chen is currently employed at Advanced Semiconductor Engineering, Inc., where he continues to develop innovative solutions in semiconductor technology. His expertise in semiconductor packaging has positioned him as a key player in the industry.

Collaborations

Chen has collaborated with notable colleagues, including Tang-Yuan Chen and Yu-Chang Chen, contributing to various projects that advance semiconductor technology.

Conclusion

Bo-Syun Chen's contributions to semiconductor packaging through his patents and collaborations highlight his role as an influential inventor in the field. His work continues to impact the efficiency and effectiveness of semiconductor devices.