Advanced Semiconductor Engineering, Inc.

Bo-Syun Chen

Chin-Li Kao

Tang-Yuan Chen

Meng-Kai Shih

Jin-Feng Yang

Yu-Chang Chen

A semiconductor package structure includes: (1) a first substrate; (2) at least one first semiconductor element attached to the first substrate; and (3) a second substrate including a plurality of thermal vias and a plurality of conductive vias, wherein one end of each of the thermal vias directly contacts the first semiconductor element.

Semiconductor package structure and method for manufacturing the same

A semiconductor package structure includes a first substrate, at least one first semiconductor element and a second substrate. The first semiconductor element is attached to the first substrate. The second substrate defines a cavity and includes a plurality of thermal vias. One end of each of the thermal vias is exposed in the cavity, and the first semiconductor element is disposed within the cavity and thermally connected to the thermal vias.

Growing community of inventors

Kaohsiung, Taiwan

Bo-Syun Chen