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For the Inventor, By the Inventor

Suwon, South Korea

Bo-Ram Kang

This inventor holds 2 USPTO granted patents. Top assignee: Samsung Electronics Co., Ltd.. Active years: 2012-2013.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bo-Ram Kang. Retrieved from https://idiyas.com/inventor/bo-ram-kang-dhaqva2n

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

Calculating rank
USPTO Granted Patents = 2

% Patents Active = 100.0

Average Co-Inventor Count = 4.0

ph-index = 1

Forward Citations = 4(Granted Patents)


Company Filing History:

goldMedal2 out of 132,108 
 
Samsung Electronics Co., Ltd.
 patents

Years Active: 2012-2013

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2 patents (USPTO):Explore Patents
1. 8395270 - Etching composition for an under-bump metallurgy layer (2013-03-12),
2. 8110508 - Method of forming a bump structure using an etching composition for an under bump metallurgy layer (2012-02-07),

Title: Bo-Ram Kang: Innovator in Under-Bump Metallurgy

Introduction

Bo-Ram Kang is a notable inventor based in Suwon-si, South Korea. He has made significant contributions to the field of under-bump metallurgy, particularly through his innovative etching compositions. With a total of 2 patents, Kang's work is recognized for its practical applications in semiconductor manufacturing.

Latest Patents

Kang's latest patents focus on an etching composition for an under-bump metallurgy (UBM) layer. This composition includes approximately 40% to 90% by weight of hydrogen peroxide, 1% to 20% by weight of an aqueous basic solution containing ammonium hydroxide or tetraalkylammonium hydroxide, 0.01% to 10% by weight of an alcohol compound, and 2% to 30% by weight of an ethylenediamine-based chelating agent. The etching composition is designed to effectively etch UBM layers that include titanium or titanium tungsten while removing impurities. Additionally, the method of forming a bump structure utilizes this innovative etching composition.

Career Highlights

Bo-Ram Kang is currently employed at Samsung Electronics Co., Ltd., where he continues to develop cutting-edge technologies in the semiconductor industry. His work has been instrumental in enhancing the efficiency and effectiveness of manufacturing processes.

Collaborations

Kang collaborates with talented coworkers, including Dong-Min Kang and Young-Nam Kim, who contribute to the innovative environment at Samsung Electronics.

Conclusion

Bo-Ram Kang's contributions to under-bump metallurgy through his patents and work at Samsung Electronics highlight his role as a key innovator in the semiconductor field. His advancements are paving the way for improved manufacturing techniques and technologies.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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