The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 07, 2012
Filed:
Nov. 21, 2008
Dong-min Kang, Anyang-si, KR;
Bo-ram Kang, Suwon-si, KR;
Young-nam Kim, Suwon-si, KR;
Young-sam Lim, Bucheon-si, KR;
Dong-Min Kang, Anyang-si, KR;
Bo-Ram Kang, Suwon-si, KR;
Young-Nam Kim, Suwon-si, KR;
Young-Sam Lim, Bucheon-si, KR;
Samsung Electronics Co., Ltd., Suwon-si, Gyeonggi-do, KR;
Abstract
In an etching composition for an under-bump metallurgy (UBM) layer and a method of forming a bump structure, the etching composition includes about 40% by weight to about 90% by weight of hydrogen peroxide (HO), about 1% by weight to about 20% by weight of an aqueous basic solution including ammonium hydroxide (NHOH) or tetraalkylammonium hydroxide, about 0.01% by weight to about 10% by weight of an alcohol compound, and about 2% by weight to 30% by weight of an ethylenediamine-based chelating agent. The etching composition may effectively etch the UBM layer including titanium or titanium tungsten and remove impurities. A method of forming a bump structure may employ such an etching composition.