Bo In Noh

Title: Bo In Noh: Innovator in Semiconductor Packaging

Introduction

Bo In Noh is a prominent inventor based in Suwon-si, South Korea. He has made significant contributions to the field of semiconductor technology. His innovative work has led to the development of a unique semiconductor package that enhances the efficiency and functionality of electronic devices.

Latest Patents

Bo In Noh holds a patent for a semiconductor package. This semiconductor package includes a first stack with a first semiconductor substrate, a through via that penetrates the substrate, and a second stack that interfaces with the first. The design features a first pad in contact with the through via and a second pad with a concave inner side face. A bump connects the first and second pads, which includes a first upper bump and a first lower bump. This invention represents a significant advancement in semiconductor packaging technology.

Career Highlights

Bo In Noh is currently employed at Samsung Electronics Co., Ltd. His role at this leading technology company allows him to work on cutting-edge innovations in the semiconductor industry. His expertise and contributions have been instrumental in advancing the company's technological capabilities.

Collaborations

Throughout his career, Bo In Noh has collaborated with talented colleagues, including Yong Ho Kim and Jeong Hoon Ahn. These collaborations have fostered a creative environment that encourages innovation and the development of groundbreaking technologies.

Conclusion

Bo In Noh is a notable inventor whose work in semiconductor packaging has made a significant impact on the industry. His patent and contributions at Samsung Electronics Co., Ltd. highlight his role as a key player in advancing technology.