Bo-Eun Park

Title: Bo-Eun Park: Innovator in Thin Film Technology

Introduction

Bo-Eun Park is a prominent inventor based in Hwaseong-si, South Korea. He has made significant contributions to the field of thin film technology, particularly through his innovative patents. With a total of 2 patents, Park continues to push the boundaries of electronic device manufacturing.

Latest Patents

His latest patents focus on a thin film structure that includes a dielectric material layer. This structure comprises a first conductive layer, a dielectric material layer on the first conductive layer, and an upper layer on the dielectric material layer. The dielectric material layer, which includes HfAO, meets specific conditions regarding thickness and composition. In one condition, the dielectric material layer is formed to a thickness of 5 nm or less, while in another condition, the x in HfAO is within a range of 0.3 to 0.5. These innovations are crucial for enhancing the performance of electronic devices.

Career Highlights

Bo-Eun Park is currently employed at Samsung Electronics Co., Ltd., where he applies his expertise in developing advanced technologies. His work has been instrumental in improving the efficiency and functionality of electronic components.

Collaborations

Throughout his career, Park has collaborated with notable colleagues, including Jooho Lee and Yongsung Kim. These partnerships have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Bo-Eun Park is a key figure in the realm of thin film technology, with a focus on enhancing electronic devices through his patented innovations. His contributions continue to shape the future of technology in significant ways.