Sollentuna, Sweden

Bo Anders Lindgren


Average Co-Inventor Count = 4.0

ph-index = 2

Forward Citations = 11(Granted Patents)


Company Filing History:


Years Active: 2001-2003

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3 patents (USPTO):Explore Patents

Title: Bo Anders Lindgren: Innovator in Integrated Circuit Technology

Introduction

Bo Anders Lindgren is a notable inventor based in Sollentuna, Sweden. He has made significant contributions to the field of integrated circuit technology, holding a total of 3 patents. His work focuses on enhancing high-speed communication through innovative manufacturing methods.

Latest Patents

Lindgren's latest patents include advancements in integrated circuit components and their manufacturing methods. One of his key inventions relates to a collector pin and a trench in an integrated circuit designed for high-speed communication. This invention involves creating an area that is implantation damaged or made amorphous and at least partially doped through ion implantation. The semiconductor structure is then heat treated to achieve optimal performance. Additionally, the trench is formed by etching the semiconductor structure and depositing various layers, including a first oxide layer and a barrier layer, to enhance the functionality of the integrated circuit.

Career Highlights

Lindgren is associated with Telefonaktiebolaget LM Ericsson (publ), a leading telecommunications company. His work at Ericsson has allowed him to contribute to cutting-edge technologies that drive the industry forward. His expertise in semiconductor technology has positioned him as a valuable asset in the field.

Collaborations

Throughout his career, Lindgren has collaborated with esteemed colleagues such as Hans Erik Norstrom and Sam-Hyo Hong. These partnerships have fostered innovation and have led to the development of advanced technologies in integrated circuits.

Conclusion

Bo Anders Lindgren's contributions to integrated circuit technology exemplify his commitment to innovation and excellence. His patents and work at Ericsson continue to influence the future of high-speed communication.

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