Company Filing History:
Years Active: 2022
Title: Biswadeep Saha: Innovator in Metal Alloy Interconnects
Introduction
Biswadeep Saha is a notable inventor based in Beaverton, OR (US). He has made significant contributions to the field of integrated circuit technology. His work focuses on the development of advanced metal alloy interconnects, which are crucial for modern electronic devices.
Latest Patents
Saha holds a patent for "Void-free high aspect ratio metal alloy interconnects and method of manufacture using a solvent-based etchant." This innovative patent describes an integrated circuit structure that includes a dielectric layer on a substrate. The invention features an open structure within the dielectric layer, where a void-free metal-alloy interconnect is formed. This interconnect comprises a combination of two or more metallic elements, excluding any mixing effects of a seed layer or liner deposited prior to the metal fill material, as well as any doping material effects on the metal fill material. He has 1 patent to his name.
Career Highlights
Saha is currently employed at Intel Corporation, a leading technology company known for its advancements in semiconductor manufacturing. His work at Intel has positioned him as a key player in the development of innovative technologies that enhance the performance and reliability of electronic devices.
Collaborations
Throughout his career, Saha has collaborated with talented individuals such as Shaestagir Chowdhury and Sirikarn Surawanvijit. These collaborations have contributed to the successful development of his patented technologies.
Conclusion
Biswadeep Saha's contributions to the field of metal alloy interconnects demonstrate his innovative spirit and commitment to advancing technology. His work continues to impact the electronics industry positively.