This inventor holds 1 USPTO granted patent. Top assignee: Applied Materials, Inc.. Active years: 2026.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile
Company Filing History:
Years Active: 2026
Title: Bingqian Liu and Metal Gapfill Innovation.
Introduction
Bingqian Liu is an inventor based in Sunnyvale, California. His patent work includes a method for metal gapfill, and the provided information lists Applied Materials, Inc. as his company.
Latest Patents
The listed patent, “Method for Metal Gapfill,” describes depositing a metal layer on a dielectric layer using plasma-enhanced atomic layer deposition. The process uses a metal halide precursor and a plasma containing hydrogen and a noble gas. Metal gapfill material is then deposited directly over the metal layer to completely fill the feature opening. Liu is credited with 1 patent in the provided data.
Career Highlights
Liu’s listed invention addresses metal deposition and feature filling in semiconductor manufacturing. The provided information associates his work with Applied Materials, Inc.
Collaborations
The provided data names Yi Xu and Yu Lei as Liu’s coworkers.
Conclusion
Bingqian Liu’s listed patent presents a metal gapfill process designed to fill feature openings, reflecting his contribution to semiconductor manufacturing technology.
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile