Bing-Kuen Lin

Title: Innovations of Bing-Kuen Lin in Carrier Substrate Manufacturing

Introduction

Bing-Kuen Lin is a notable inventor based in Tali, Taiwan. He has made significant contributions to the field of manufacturing, particularly in the development of carrier substrates. His innovative approach has led to the creation of a patented method that enhances the efficiency and effectiveness of substrate manufacturing.

Latest Patents

Bing-Kuen Lin holds a patent for a "Method for manufacturing carrier substrate." This patent outlines a comprehensive process that includes several key steps. The method begins with providing a core substrate, followed by forming a build-up material layer on it. A via is then created in the build-up material layer, and a patterned photoresist layer is applied, covering part of the via while exposing an opening. This opening connects to a wiring slot, which is also formed. The final step involves creating a metal-electroplated layer on both the via and the wiring slot. This innovative approach allows for the trace to be directly connected to the via, thereby increasing the wiring space by eliminating the need for an annular ring.

Career Highlights

Bing-Kuen Lin is currently employed at Kinsus Interconnect Technology Corporation, where he continues to develop and refine his innovative methods. His work has been instrumental in advancing the technology used in carrier substrates, making significant impacts in the industry.

Collaborations

Throughout his career, Bing-Kuen Lin has collaborated with talented individuals such as Jun-Chung Hsu and Chao-Lung Wang. These collaborations have fostered a creative environment that encourages innovation and the sharing of ideas.

Conclusion

Bing-Kuen Lin's contributions to the field of carrier substrate manufacturing exemplify the spirit of innovation. His patented methods not only enhance manufacturing processes but also pave the way for future advancements in the industry.