Bin-Hui Tseng

Title: The Innovations of Bin-Hui Tseng

Introduction

Bin-Hui Tseng is a notable inventor based in Hsinchu County, Taiwan. He has made significant contributions to the field of semiconductor technology. His work focuses on innovative packaging solutions that enhance the performance and reliability of semiconductor devices.

Latest Patents

One of Bin-Hui Tseng's key patents is for a semiconductor package and manufacturing method. This patent describes a semiconductor package that includes a chip stack, at least one conductive wire, a first insulating encapsulant, a second insulating encapsulant, and a redistribution layer. The chip stack consists of semiconductor chips stacked on top of each other, with each chip featuring an active surface that has bonding regions exposed by the chip stack. The conductive wire is strategically placed on the bonding region, and the first insulating encapsulant encapsulates both the bonding region and the conductive wire. Notably, a portion of each conductive wire remains exposed from the first insulating encapsulant. The second insulating encapsulant encapsulates the chip stack and the first insulating encapsulant, ensuring that the first insulating encapsulant is visible from the second insulating encapsulant. The redistribution layer is then positioned on both insulating encapsulants and is electrically connected to the conductive wire.

Career Highlights

Bin-Hui Tseng is currently employed at Powertech Technology Inc., a leading company in semiconductor packaging and testing. His expertise in semiconductor technology has positioned him as a valuable asset to the company. His innovative approaches have contributed to advancements in the industry.

Collaborations

Throughout his career, Bin-Hui Tseng has collaborated with talented individuals such as Kun-Yung Huang and Chi-Liang Pan. These collaborations have fostered a creative environment that encourages the development of cutting-edge technologies.

Conclusion

Bin-Hui Tseng's contributions to semiconductor packaging demonstrate his commitment to innovation and excellence in technology. His patent for a semiconductor package showcases his ability to address complex challenges in the field. Through his work at Powertech Technology Inc. and collaborations with esteemed colleagues, he continues to make a significant impact in the industry.