Chandler, AZ, United States of America

Biju Chandran


Average Co-Inventor Count = 2.0

ph-index = 9

Forward Citations = 224(Granted Patents)


Location History:

  • Vienna, VA (US) (2010)
  • Chandler, AZ (US) (2001 - 2012)

Company Filing History:


Years Active: 2001-2012

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22 patents (USPTO):Explore Patents

Title: Biju Chandran: Pioneering Innovations in Semiconductor Packaging

Introduction

Biju Chandran, based in Chandler, AZ, is an accomplished inventor with a remarkable portfolio of 22 patents. His work primarily focuses on advancements in semiconductor packaging processes, demonstrating his commitment to enhancing the efficiency and reliability of electronic devices.

Latest Patents

Chandran's latest innovations include two notable patents that outline a modified chip attach process. The first patent describes a sophisticated method for assembling a semiconductor device package. This process effectively reduces stress in an inner dielectric layer during packaging by leveraging a sequence of temperature adjustments. By heating both the die and substrate to a reflow temperature for solder, then cooling to allow epoxy liquefaction, he ensures a strong and durable bond.

The second patent further expands on this technique by detailing a method of attaching an integrated circuit (IC) die to a substrate. In this embodiment, solder is reflowed at a higher temperature, then solidifies to form robust electrical connections. Following this, a liquid curable underfill material is introduced into the gap between the IC die and substrate. This step is cleverly executed with the assistance of capillary action, maintaining a lower temperature to cure the underfill without compromising the integrity of the solidified solder.

Career Highlights

As a key contributor to Intel Corporation, Chandran has played a vital role in driving innovation in semiconductor technology. His extensive work in developing advanced packaging solutions has significantly influenced the performance and reliability of electronic devices.

Collaborations

Throughout his career, Biju Chandran has collaborated with esteemed colleagues such as Rajen C. Dias and Carlos A. Gonzalez. Together, they have contributed to groundbreaking advancements in semiconductor technologies, underscoring the importance of teamwork in the innovation process.

Conclusion

Biju Chandran exemplifies the spirit of innovation in the semiconductor industry. Through his numerous patents and collaborative efforts, he continues to define the future of electronic packaging, ensuring that technology keeps advancing to meet the demands of a rapidly evolving marketplace.

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