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For the Inventor, By the Inventor

Chandler, AZ, United States of America

Biju Chandran

This inventor holds 22 USPTO granted patents, primarily in Microelectronic Packaging. Top assignee: Intel Corporation. Active years: 2001-2012.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Biju Chandran. Retrieved from https://idiyas.com/inventor/biju-chandran

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

USPTO Granted Patents = 22

% Patents Active = 50.0

Average Co-Inventor Count = 2.0

ph-index = 9

Forward Citations = 225(Granted Patents)


Location History:

  • Vienna, VA (US) (2010)
  • Chandler, AZ (US) (2001 - 2012)

Company Filing History:

goldMedal22 out of 56,322 
 
Intel Corporation
 patents

Years Active: 2001-2012

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Areas of Expertise:
Chip Attach Process
Integrated Circuit
Microelectronic Device
Thermal Contact
Mechanical Flexure
Backside Metallization
Ball Grid Array
Heat Sink
Semiconductor Package
Interconnects
Package Retention
22 patents (USPTO):Explore Patents
1. 8324737 - Modified chip attach process (2012-12-04),
2. 7901982 - Modified chip attach process (2011-03-08),
3. 7745917 - Compliant integrated circuit package substrate (2010-06-29),
4. 7691667 - Compliant integrated circuit package substrate (2010-04-06),
5. 7579213 - Modified chip attach process (2009-08-25),
6. 7314817 - Microelectronic device interconnects (2008-01-01),
7. 7304391 - Modified chip attach process and apparatus (2007-12-04),
8. 7235886 - Chip-join process to reduce elongation mismatch between the adherents and semiconductor package made thereby (2007-06-26),
9. 7202420 - Methods to prevent mechanical flexure related BGA failure (2007-04-10),
10. 7122403 - Method of interconnecting die and substrate (2006-10-17),
11. 7078822 - Microelectronic device interconnects (2006-07-18),
12. 7064014 - Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices (2006-06-20),
13. 6955947 - Backside metallization on microelectronic dice having beveled sides for effective thermal contact with heat dissipation devices (2005-10-18),
14. 6919224 - Modified chip attach process and apparatus (2005-07-19),
15. 6812548 - Backside metallization on sides of microelectronic dice for effective thermal contact with heat dissipation devices (2004-11-02),

Title: Biju Chandran: Pioneering Innovations in Semiconductor Packaging

Introduction

Biju Chandran, based in Chandler, AZ, is an accomplished inventor with a remarkable portfolio of 22 patents. His work primarily focuses on advancements in semiconductor packaging processes, demonstrating his commitment to enhancing the efficiency and reliability of electronic devices.

Latest Patents

Chandran's latest innovations include two notable patents that outline a modified chip attach process. The first patent describes a sophisticated method for assembling a semiconductor device package. This process effectively reduces stress in an inner dielectric layer during packaging by leveraging a sequence of temperature adjustments. By heating both the die and substrate to a reflow temperature for solder, then cooling to allow epoxy liquefaction, he ensures a strong and durable bond.

The second patent further expands on this technique by detailing a method of attaching an integrated circuit (IC) die to a substrate. In this embodiment, solder is reflowed at a higher temperature, then solidifies to form robust electrical connections. Following this, a liquid curable underfill material is introduced into the gap between the IC die and substrate. This step is cleverly executed with the assistance of capillary action, maintaining a lower temperature to cure the underfill without compromising the integrity of the solidified solder.

Career Highlights

As a key contributor to Intel Corporation, Chandran has played a vital role in driving innovation in semiconductor technology. His extensive work in developing advanced packaging solutions has significantly influenced the performance and reliability of electronic devices.

Collaborations

Throughout his career, Biju Chandran has collaborated with esteemed colleagues such as Rajen C. Dias and Carlos A. Gonzalez. Together, they have contributed to groundbreaking advancements in semiconductor technologies, underscoring the importance of teamwork in the innovation process.

Conclusion

Biju Chandran exemplifies the spirit of innovation in the semiconductor industry. Through his numerous patents and collaborative efforts, he continues to define the future of electronic packaging, ensuring that technology keeps advancing to meet the demands of a rapidly evolving marketplace.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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