Bidzina Kekelia

Title: Innovations of Bidzina Kekelia in Heat Flux Micro Coolers

Introduction

Bidzina Kekelia is an innovative inventor based in Golden, Colorado. He has made significant contributions to the field of thermal management through his patented inventions. His work focuses on enhancing the efficiency of cooling devices, which are crucial in various applications.

Latest Patents

Kekelia holds a patent for "Heat flux micro coolers having multi-stepped features and fluid wicking." This invention features a cooler device that includes a cold plate and a manifold with a fluid wicking structure. The cold plate is designed with an array of bonding posts and fluid channels, where each bonding post has a first height and is in contact with the manifold. The fluid channels have a second height that is less than the first height, incorporating a MIO secondary wick structure. The design ensures that the array of bonding posts is orthogonal to the fluid channels, enhancing the cooling efficiency.

Career Highlights

Throughout his career, Kekelia has worked with notable organizations, including Toyota Motor Engineering & Manufacturing North America, Inc. and Leland Stanford Junior University. His experience in these institutions has allowed him to refine his skills and contribute to advanced research in thermal management technologies.

Collaborations

Kekelia has collaborated with talented individuals such as Chi Zhang and Qianying Wu. These partnerships have fostered innovation and have been instrumental in the development of his patented technologies.

Conclusion

Bidzina Kekelia's contributions to the field of heat flux micro coolers demonstrate his commitment to innovation and excellence. His patented inventions are paving the way for more efficient cooling solutions in various industries.