The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Aug. 15, 2023
Filed:
Jan. 13, 2022
Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);
The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);
The Regents of the University of California, Merced, Merced, CA (US);
Alliance for Sustainable Energy, Llc, Golden, CO (US);
Chi Zhang, Palo Alto, CA (US);
Qianying Wu, Stanford, CA (US);
Muhammad Shattique, Merced, CA (US);
Neda Seyedhassantehrani, Merced, CA (US);
Souvik Roy, Merced, CA (US);
James Palko, Merced, CA (US);
Sreekant Narumanchi, Littleton, CO (US);
Bidzina Kekelia, Golden, CO (US);
Sougata Hazra, Stanford, CA (US);
Kenneth E. Goodson, Portola Valley, CA (US);
Roman Giglio, Costa Mesa, CA (US);
Ercan M. Dede, Ann Arbor, MI (US);
Mehdi Asheghi, Oakland, CA (US);
Toyota Motor Engineering & Manufacturing North America, Inc., Plano, TX (US);
The Board of Trustees of the Leland Stanford Junior University, Stanford, CA (US);
The Regents of the University of California, Merced, Merced, CA (US);
Alliance for Sustainable Energy, LLC, Golden, CO (US);
Abstract
A cooler device includes a cold plate and a manifold with fluid wicking structure. The cold plate includes an array of bonding posts and an array of fluid channels. Each bonding post of the array of bonding posts has a first height and is in contact with the manifold with fluid wicking structure. Each fluid channel of the array of fluid channels has a second height that is less than the first height. The array of fluid channels include a MIO secondary wick structure. The array of bonding posts is orthogonal to the array of fluid channels. The manifold with fluid wicking structure includes a plurality of spacer elements and a plurality of mesh layers. Each one of the plurality of spacer elements alternate with each one of the plurality of mesh layers in a stacked arrangement.