This inventor holds 1 USPTO granted patent. Top assignee: Globalfoundries Inc.. Active years: 2016.
Company Filing History:
Years Active: 2016
Title: Innovations by BethAnn Rainey Lawrence
Introduction
BethAnn Rainey Lawrence is a notable inventor based in Williston, Vermont. He has made significant contributions to the field of substrate bonding, showcasing his expertise through his innovative patent.
Latest Patents
BethAnn holds a patent titled "Flattened substrate surface for substrate bonding." This patent outlines methods for bonding substrate surfaces, bonded substrate assemblies, and design structures for a bonded substrate assembly. The invention details how device structures of a product chip are formed using a first surface of a device substrate. A wiring layer of an interconnect structure for the device structures is formed on the product chip, which is then planarized. A temporary handle wafer is removably bonded to the planarized wiring layer. Following this, the second surface of the device substrate, opposite to the first surface, is bonded to a final handle substrate. The temporary handle wafer is subsequently removed from the assembly.
Career Highlights
BethAnn is currently employed at GlobalFoundries Inc., where he continues to innovate and contribute to advancements in semiconductor technology. His work has been instrumental in enhancing the efficiency and effectiveness of substrate bonding processes.
Collaborations
Some of his notable coworkers include Edward Crandal Cooney, III and James Stuart Dunn. Their collaboration has likely fostered an environment of innovation and creativity within their projects.
Conclusion
BethAnn Rainey Lawrence's contributions to substrate bonding technology exemplify the impact of innovative thinking in the field of semiconductor manufacturing. His patent reflects a significant advancement that can influence future developments in the industry.