Saratoga, CA, United States of America

Bernard Glasauer

This inventor holds 1 USPTO granted patent. Top assignee: Juniper Networks, Inc.. Active years: 2026.

IDiyas Innovation Intelligence. (2026). Inventor Profile: Bernard Glasauer. Retrieved from https://idiyas.com/inventor/bernard-glasauer

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile


% Patents Active = 100.0

Average Co-Inventor Count = 3.0

ph-index = 1


Company Filing History:


Years Active: 2026

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1 patent (USPTO):Explore Patents

Title: Bernard Glasauer: Innovator in Integrated Circuit Technology

Introduction

Bernard Glasauer is a notable inventor based in Saratoga, CA (US). He has made significant contributions to the field of integrated circuit technology, particularly in the reinforcement of solder joints.

Latest Patents

Glasauer holds a patent for an "Apparatus, system, and method for reinforcing solder joints by bracing corners of integrated circuit substrates." This innovative apparatus is designed to enhance the reliability of solder joints by incorporating corner reinforcement braces that are coupled to both the circuit board and the corners of the integrated circuit substrate. The patent outlines various apparatuses, systems, and methods that further advance this technology.

Career Highlights

Bernard Glasauer is currently employed at Juniper Networks, Inc., where he continues to develop and refine technologies related to integrated circuits. His work has been instrumental in improving the durability and performance of electronic devices.

Collaborations

Throughout his career, Glasauer has collaborated with talented professionals such as Peng Su and Omar Ahmed. These partnerships have fostered innovation and contributed to the success of various projects within the company.

Conclusion

In summary, Bernard Glasauer is a distinguished inventor whose work in integrated circuit technology has led to valuable advancements in the field. His patent for reinforcing solder joints exemplifies his commitment to innovation and excellence in engineering.

Profile summary based on public USPTO records.
Data Sources: USPTO Patent Grant XML, Patent Center, EPO & CIPO • Normalized by IDiyas Innovation Graph. Methodology & provenance architecturePlease report any incorrect information to [email protected]
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