The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Mar. 10, 2026
Filed:
Jul. 31, 2023
Applicant:
Juniper Networks, Inc., Sunnyvale, CA (US);
Inventors:
Assignee:
Juniper Networks, Inc., Sunnyvale, CA (US);
Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H05K 1/02 (2006.01); H05K 3/3494 (2026.01);
U.S. Cl.
CPC ...
H05K 1/0271 (2013.01); H05K 3/3494 (2013.01); H05K 2201/2009 (2013.01); H05K 2203/1581 (2013.01);
Abstract
An apparatus may reinforce solder joints by bracing corners of integrated circuit substrates. To do so, an exemplary apparatus may include (1) a substrate of an integrated circuit coupled to a circuit board and (2) at least one corner reinforcement brace coupled to the circuit board and at least one corner of the substrate. Various other apparatuses, systems, and methods are also disclosed.
Ahmed, Omar. (2026). Apparatus, system, and method for reinforcing solder joints by bracing corners of integrated circuit substrates (U.S. Patent No. 12575024). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/12575024
Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile