Benjamin Bernard

Title: The Innovations of Benjamin Bernard

Introduction

Benjamin Bernard is a notable inventor based in Villach, Austria. He has made significant contributions to the field of semiconductor technology, holding 2 patents that showcase his expertise and innovative spirit.

Latest Patents

One of his latest patents is a method of manufacturing semiconductor devices by filling grooves formed in a front side surface of a wafer with a side face protection material. This method involves several steps, including forming grooves in the wafer's front side surface, filling these grooves with a first side face protection material, thinning the wafer at its backside surface, depositing a backside metallization layer, and finally, laser cutting along the grooves to separate the wafer into multiple semiconductor devices. Another significant patent is for a semiconductor device that features a thin semiconductor die. This device includes a semiconductor die with a front side surface, a backside surface, and side faces. A backside metallization layer is deposited over the backside surface and extends laterally beyond the side faces, while a side face protection layer covers the side faces.

Career Highlights

Benjamin Bernard is currently employed at Infineon Technologies AG, a leading company in semiconductor solutions. His work at Infineon has allowed him to apply his innovative ideas and contribute to advancements in semiconductor manufacturing.

Collaborations

Throughout his career, Benjamin has collaborated with talented individuals such as Christian Gruber and Tobias Polster. These collaborations have further enriched his work and led to the development of cutting-edge technologies in the semiconductor field.

Conclusion

Benjamin Bernard's contributions to semiconductor technology through his patents and work at Infineon Technologies AG highlight his role as an influential inventor. His innovative methods and devices continue to shape the future of the semiconductor industry.